Product ID Document Name Status ANSI DoD
IPC-HM-860
Specification for Multilayer Hybrid Circuits Orig. 1/87
IPC-TF-870
Qualification and Performance of Polymer Thick Film Printed
Boards
Orig. 11/89
IPC-ML-910
Design and End Production Specification for Rigid Multilayer
Printed Boards
Superseded by IPC-D-949, IPC-D-
275, and subsequently IPC-2221 for
Design and IPC-ML-950, IPC-RB-
276, and subsequently IIPC-6011 for
End Product Specification
Rev. A 08/76
Orig. 06/68
IPC-D-949
Design Standard for Rigid Multilayer Printed Boards Superseded by IPC-D-275 and
subsequently by IPC-2221/2222
Orig. 1/87
IPC-ML-950
Performance Specification for Rigid Multilayer Printed Boards Superseded by IPC-RB-276 and
subsequently IPC-6011/6012
Rev. C 11/8
Rev. B 12/77
Rev. A 9/70
Orig. 1/66
IPC-ML-960
Qualification and Performance Specification for Mass Laminated
Panels for Multilayer Printed Boards
Orig. 7/94
IPC-ML-975
End Product Documentation Specification for Multilayer Printed
Wiring Boards
Superseded by IPC-D-325
Orig. 9/69
IPC-ML-990
Performance Specification for Flexible Multilayer Wiring Superseded by IPC-6011
Orig. 9/72
IPC-1043
Cleaning & Cleanliness Test Program Phase 3 Water Soluble
Fluxes Part 1
Orig. 8/92
IPC-1044
Cleaning & Cleanliness Test Program Phase 3 Water Soluble
Fluxes Part 2
Orig. 10/92
IPC-TP-1090
The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A
or MT-0002
Orig. 7/96
IPC-TP-1103
Manufacturing Concerns When Soldering with Gold Plated
Component Leads or Circuit Board Pads
Obsolete without replacement
IPC-TP-1114
The Layman's Guide to Qualifying a Process to J-STD-001B Orig. 1/98
IPC-TP-1115
Selection and Implementation Strategy for A Low-Residue No-
Clean Process
Orig. 12/98
IPC-1131
IT Guidelines for PWB Manufacturers Orig. 04/00
IPC-1331
Voluntary Safety Standard for Electrically Heated Process
Equipment
Orig. 3/00
IPC-1710
OEM Standard for Printed Board Manufacturers' Qualification
Profile (MQP)
12/97 updated
Orig. 2/94
IPC-1720
Assembly Qualification Profile (AQP) Orig. 7/96
IPC-1730
Laminator Qualification Profile (LQP) Rev. A 6/00
Orig. 1/98
IPC-1731
Strategic Raw Materials Supplier Qualification Profile Orig. Pub. 6/00
IPC-1902
IPC/IEC Grid Systems for Printed Circuits Orig. Pub. 12/98
IPC-2141
Controlled Impedance Circuit Boards and High Speed Logic Design Orig. 4/96
IPC-2221
Generic Standard on Printed Board Design Supersedes IPC-D-275
Amend. 1 01/00
Orig. 2/98
IPC-2222
Sectional Design Standard for Rigid Organic Printed Boards Supersedes IPC-D-275
Orig. 2/98
IPC-2223 Sectional Design Standard for Flexible Printed Boards Supersedes IPC-D-249
Orig. 11/98
IPC-2224
Sectional Standard for Design of PWBs for PC Cards Orig. 01/98
IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-
L) and MCM-L Assemblies
Orig. 05/98
IPC-2226
Design Standard for High-Density Array or Peripheral Leaded
Component Mounting Structures
Not yet published
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